PhotonIcs and Electromagnetics Research Symposium,
also known as Progress In Electromagnetics Research Symposium
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Published by The Electromagnetics Academy
Published: 2015-07-09
The Optimized Electrode between a SMPM Connector and a Microstrip for High Frequency Applications
By
Yaw-Dong Wu,
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    Yaw-Dong Wu

    National Kaohsiung University of Applied Sciences, Taiwan, R.O.C.

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Jau-Ji Jou,
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    Jau-Ji Jou

    National Kaohsiung University of Applied Sciences, Taiwan

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Hong-Lu Lin,
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    Hong-Lu Lin

    National Kaohsiung University of Applied Sciences, Taiwan

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Tien-Tsorng Shih,
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    Tien-Tsorng Shih

    National Kaohsiung University of Applied Sciences, Taiwan, R.O.C.

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Cheng-Ying Wu
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    Cheng-Ying Wu

    National Kaohsiung University of Applied Sciences, Taiwan

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Proceedings of 2015 Photonics & Electromagnetics Research Symposium, Prague, July 6 - 9，Page(s)149-152
Abstract
In this paper, a smaller and cheaper novel Subminiature Modular Plug-in Mini (SMPM) connector has been used to replace a K-type connector. The SMPM connector is installed on the top of printed circuit board (PCB) and soldering with an electrode to reduce the trace of a microstrip and to maintain the high frequency performance. Three designs of the PCB electrode have been simulated and verified experimentally. The optimized impedance mismatch of the soldering point between a SMPM connector and the PCB electrode is controlled within a range of ±2-Ohm. The 3-dB bandwidth of the whole setup including two SMPM connectors and a 2.5-cm long microstrip is above 25-GHz. This optimization can be used in designing high-speed PCB for the application of 100GBASE Ethernet.
Citation
Yaw-Dong Wu, Jau-Ji Jou, Hong-Lu Lin, Tien-Tsorng Shih, and Cheng-Ying Wu, "The Optimized Electrode between a SMPM Connector and a Microstrip for High Frequency Applications," Proceedings of 2015 Photonics & Electromagnetics Research Symposium, Prague, July 6 - 9，Page(s)149-152
References

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