paper 150205205136

Abstract

In this work, a surface-mount type (SMT) pad using a coaxial-line structure is presented for low temperature co-fired ceramic (LTCC) SiP (system-in-package) applications. The vertical via transition is devised in type of the coaxial line. An overlap part between its outer conductor and a transmission line on the main board is cut off in order to eliminate their interaction. A cap on the top layer of the vertical via transition is designed in order to reduce radiation due to discontinuity. The designed SMT pad was fabricated using the standard LTCC process. The measured return and insertion loss are below −14 and −1.0 dB, respectively up to 15 GHz.

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Young Chul Lee