This paper describes the development compact Chebyshev microstrip filter is fab- ricated by using RF MEMS technology, which laser micromachining techniques are selected. The 5th order Chebyshev low pass filter operating within UHF range have been designed, sim- ulated, fabricated, tested, investigated and implemented on silicon substrate with a band pass ripple of 0.01 dB. The design of lumped element and microstrip circuit filters are simulated and implemented by using Advanced Design System. The simulation and measurement results of microstrip low pass filter have been compared and excellent agreement is observed. Laser micro- machining can lead to finer finishes, improved accuracy and less process overhead. The purpose for this work has been focus on laser micromachining into develop compact microstrip circuit. To satisfy these challenging in terms of geometry, machining accuracy, surface finish or processing speed, laser micromachining with diffraction limited beam quality offer many benefits such as small spot size, high power density, enhanced processing speeds, reduced heat affected zone for a range of micromachining applications. Laser micromachining has become a great prospective as a MEMS (micro-electro-mechanical systems) fabrication technique in ever-continuing trend of miniaturization in microelectronics, micro-optics and micromechanics for wireless communication system.