Optical Interconnect Technologies for Datacom and Computercom

Featured Plans

Optical Interconnect Technologies for Datacom and Computercom

Session Organizers

Binhao Wang

Prof.

Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences

China

Stanley Cheung

Dr.

Hewlett Packard Labs

USA

Session Infomation

In the rapidly evolving landscape of data communication and computer networks, the demand for faster, more efficient, and reliable data transfer has never been higher. Optical interconnect technologies have emerged as a pivotal solution to meet these growing needs. This session aims to cover various aspects of recent developments and advancements of optical interconnect technologies for datacom and computercom, including but not limited to photonic devices, photonic integrated circuits, 2.5D/3D integration, transceiver circuits, advanced packaging, and so on.

Submitted Articles

Note: The following submitted articles are not guaranteed to be scheduled in the final program at this stage. The final presentation type and arranged session will be decided by Technical Program Committee.

Presenting Author	Talk Time	Paper Title \| Authors \| Abstract
Dr. Hongtao Lin Zhejiang University	8:00 Invited	Nonvolatile Reconfigurable Phase-change-materials Integrated Silicon Photonics Kai Xu (Zhejiang University) Maoliang Wei (Zhejiang University) Bo Tang (Institute of Microelectronics of the Chinese Academy of Sciences) Junying Li (University of Chinese Academy of Sciences) Yiting Yun (Zhejiang University) Kunhao Lei (Zhejiang University) Yingchun Wu (Westlake University) Lan Li (Westlake University) Hongtao Lin (Zhejiang University)
Prof. Nan Qi Institute of Semiconductors, Chinese Academy of Sciences	8:20 Invited	Co-design of Si-Photonic Segmented Mach-Zehnder Modulators and Distributed CMOS Drivers for Co-packaged Optics Siyuan Ma (Institute of Semiconductors, Chinese Academy of Sciences) Yingjie Ma (Institution of Semiconductors, Chinese Academy of Sciences) Qianli Ma (Institution of Semiconductors, Chinese Academy of Sciences) Guike Li (Institute of Semiconductors, Chinese Academy of Sciences) Nanjian Wu (Institute of Semiconductors, Chinese Academy of Sciences) Xi Xiao (National Opto-electronics Innovation Center (NOEIC)) Nan Qi (Institute of Semiconductors, Chinese Academy of Sciences)
Dr. Dan Li Xi'an Jiaotong University	8:40 Invited	TIA Design for Telecom, Datacom and PON Dan Li (Xi'an Jiaotong University)
Mr. Chao Cheng Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences	9:00	A High-Power Lateral p-i-n Silicon-Germanium Photodiode Chao Cheng (Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences) Jintao Xue (Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences) Zhiyuan Yu (Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences) Jinyi Wu (Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences) Shenlei Bao (Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences) Binhao Wang (Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences)
Prof. Junhe Zhou Tongji University	9:15	Highly Efficient and Broad-Bandwidth Grating Coupler Between Optical Fiber and Sillicon-on-Insulator Waveguide Zhanhao Li (Tongji University) Wenxin Hao (Tongji University) Junhe Zhou (Tongji University)
Dr. Haiyun Xue Institute of Microelectronics of the Chinese Academy of Sciences	9:30 Invited	2.5D and 3D Advanced Packaging for Co-packaged Optics (CPO) Haiyun Xue (Institute of Microelectronics of the Chinese Academy of Sciences)